Michael Martuscello on Fri, 26 Oct 2001 22:46:02 +0200 (CEST)


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[Nettime-bold] Lambda Technologies, Microwave Solutions


Title:

SOLUTIONS FOR ADHESIVE CURING

Lambda Technologies Making Waves in Fiber Optic-Optoelectronic Market

 

 

 

 Capital equipment company commercializing on a proprietary new curing technique for applications in Fiber Optic and Optoelectronic Markets.

October 4, Morrisville, NC- Lambda Technologies’ patented Variable Frequency Microwave (VFM) technology allows significantly faster curing of standard, off-the-shelf, polymeric adhesives and coatings used to encapsulate electronic components or die attach them to circuit boards, while eliminating the hot spots and arcing associated with conventional microwave technology. Curing processes are typically accomplished using a convection oven or UV light source, but can also be done using Variable Frequency Microwave. Commonly, VFM has been used in the advanced packaging and assembly applications which include cavity dam & fill, glob top, BGA and flip chip underfill for die attach, wafer processing, chip-on-board/direct chip attach and now optical component and fiber optic assemblies.

 

VFM is being used in ferrule attach, fiber array attach, VCSEL assembly, transceiver devices and DWDM-to-fiber block assembly processing. It has been realized that VFM’s ability to selectively heat adhesive areas while minimizing coefficient of thermal expansion mismatch between the die, substrate and adhesive can enable cure of adhesives quickly and uniformly. In addition selective heating prevents damage to the fiber, jacketing and associated shielding by heating the adhesive exclusively. On the other hand, convective heating cures adhesives from the surface inward heating all components to the same temperature which ultimately contributes to component misalignment and stress generation. With VFM’s volumetric heating it is possible to cure the adhesive up to 10X faster than convection ovens, which reduces the viscous flow time of the adhesive thereby reducing part movement. One manufacturer of fiber optic devices improved their yields to over 90% with the introduction of VFM for their post-curing, while shortening their post cure time to just two minutes.

“It is an exciting time for Lambda Technologies and for our customers, as we are often able to provide immediate and significant results in productivity.  The VFM process is providing manufacturers of optoelectronic components an enabling approach to optimize their product performance features while at the same time increasing yields, obtaining higher throughput, and offering the capability to automate their production cure process”, said Richard Garard CEO of Lambda Technologies.

     

 

 

 

 

 

 

 

 

 

 

 

Our MicroCure products are also used within the electronics industry for the following applications:

Flip Chip Underfill Cure

Glob-Top and Cavity Dam & Fill

Structural Bonding of Electronic Assemblies

Post Mold Cure Die Attach & Bump Cure

Wafer Level Processes (Coatings & Encapsulation)

Optoelectronic and Fiber Optic Devices

 

 

NEWS FLASH!

Lambda Technologies may have solution for KILLING ANTHRAX!

Click Here to Learn More

 

Lambda Technologies releases NEW ! Application Note on Curing Solutions for Optoelectronics and Fiber Optic Devices

 Click Here to Learn More

 

INTERESTED IN TESTING YOUR APPLICATIONS WITH VARIABLE FREQUENCY MICROWAVE?

CLICK HERE

 

 

 

 

 

 

 

 

 

 

 

 

 

 


 

 

 

 

 

 

 

 



 

FOR MORE INFORMATION ON LAMBDA TECHNOLOGIES:

 VISIT   http://www.microcure.com/  

or call 1-888-290-2873 (CURE)

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